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SX1240
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
SX1240 - Low Cost Integrated Transmitter IC 434 MHz and 868 MHz Band RF Transmitter
GENERAL DESCRIPTION
The SX1240 is an ultra-low-cost, fully integrated FSK or OOK compatible transmitter suitable for operation in the 418, 434 and 868 MHz licence free ISM bands. For applications where economy is paramount, the SX1240 may be used without the requirement for configuration via an MCU. The transmitter is configured for default operation at a frequency of 433.92 MHz or 868.3 MHz. However, in conjunction with a microcontroller the communication link parameters may be re-configured. Including, output power, modulation format and operating channel. The SX1240 offers integrated radio performance with cost efficiency and is suited for worldwide operations in particular Europe (ETSI EN 300-220-1), North America (FCC part 15.231).
APPLICATIONS
Low-Cost Consumer Electronic Applications Remote Keyless Entry (RKE) Remote Control / Security Systems Audio Accessories Process and building / home control Active RFID
KEY PRODUCT FEATURES
+10 dBm or 0 dBm Configurable output power Bit rates up to 100 kbps FSK and OOK modulation 2 Preconfigured Modes for Operation without MCU
433.92 MHz OOK & 868.3 MHz FSK
ORDERING INFORMATION
Part Number SX1240ISTRT Temperature Range -40 C to +85 C Qty. per Reel 2500 Package SOIC8-EP
1.8 to 3.7 V supply range Low BOM Fully Integrated Tx 8 Selectable Centre Frequencies Programmable Frequency Tuning of low cost XTAL
Pb-Free, Halogen Free, RoHS/WEEE compliant product.
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SX1240
ADVANCED COMMUNICATIONS & SENSING Table of contents
Section Page
DATASHEET
1.
General Description ................................................................................................................................................. 3 1.1. 1.2. 1.3. Pin Diagram ..................................................................................................................................................... 3 Marking Diagram.............................................................................................................................................. 4 Pin Description................................................................................................................................................. 4 ESD Notice ...................................................................................................................................................... 5 Absolute Maximum Ratings ............................................................................................................................. 5 Operating Range.............................................................................................................................................. 5 Timing Characteristics ..................................................................................................................................... 7
2.
Electrical Characteristics ......................................................................................................................................... 5 2.1. 2.2. 2.3. 2.5.
2.4. Electrical Specifications 6 3. Application Modes ................................................................................................................................................... 8 3.1. Application Mode: Power & Go 9 3.1.1. 3.1.2. 3.2. 3.2.1. 3.2.2. 4. 5. `Power & Go' Mode: Configuration............................................................................................................ 9 Transmitter Operation in `Power & Go' Mode ........................................................................................... 9 Advanced Mode: Configuration............................................................................................................... 10 Transmitter Operation in Advanced Mode .............................................................................................. 11
Application Mode: Advanced ......................................................................................................................... 10
Configuration Register ........................................................................................................................................... 13 Application Information .......................................................................................................................................... 14 5.1. 5.2. Crystal Specification ...................................................................................................................................... 14 Reference Design Schematics....................................................................................................................... 14
5.3. Reference Design PCB Layout 15 5.4. Reference Design BOM 16 6. Packaging Information ........................................................................................................................................... 17 6.1. 6.2. 6.3. 7. Package Outline Drawing .............................................................................................................................. 17 Land Pattern .................................................................................................................................................. 17 Tape & Reel Specification.............................................................................................................................. 18
Revision History..................................................................................................................................................... 19
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
This product datasheet contains a detailed description of the SX1240 performance and functionality.
DATASHEET
1. General Description
The SX1240 is a fully-integrated frequency-agile, single chip transmitter IC capable of FSK and OOK modulation of an input data stream. The full application circuit is shown in Figure 9. The SX1240 is configured, by default, to operate without a microcontroller with its pre-configured RF settings (see Section 3 for precise details of the default settings). Selection is made between 434 MHz and 868 MHz band operation by setting the Control pin (6) either high or low at power-up. A full description of this functionality is given in Section 3.1. Where greater flexibility is required, many of the default communication parameters can be dynamically configured. This includes the operating frequency, frequency deviation and modulation format. Upon the application of a serial clock to the Control pin (6), the Data pin (2) can be used to load a single 13-bit control word. Accessing this functionality is subject to the connection of the control pin at start-up. For full details of this, the configuration bits and the precise timing operations of this functionality please consult Section 3.2. The SX1240 is designed for use with a variety of low-cost antenna technologies. A reference design with PCB-trace antenna is presented in Section 5. Another key feature of the SX1240 is its low current consumption in transmit and sleep modes and its wide voltage operating range from 1.8 V to 3.7 V. This makes the SX1240 suitable for low-cost battery chemistries or energy harvesting applications. The internal architecture of the SX1240 is shown in Figure 1. The SX1240 comprises a low-consumption PLL and power amplifier. For frequency modulation the modulation is performed digitally within the PLL bandwidth. OOK Modulation is performed via ramping of the PA reference DAC.
1.1. Pin Diagram
Figure 1. Pinouts, Top View
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
1.2. Marking Diagram
DATASHEET
Figure 2. Marking Diagram
Notes yyww refers to the date code xxxxx refers to the lot number
1.3. Pin Description
Table 1 Description of the SX1240 Pinouts
Name GND DATA GND XTAL VDD CTRL GND RFOUT Type I I/O I I/O I I I O Transmit Data Ground Reference Crystal Power Supply 1.8V to 3.7V Config Selection Ground Transmitter RF Output Configuration Data Clock Function in `Power & Go' Mode Ground Transmit or Configuration Data Function in `Advanced' Mode
Number 1 2 3 4 5 6 7 8
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
2. Electrical Characteristics
2.1. ESD Notice
The SX1240 is a high performance radio frequency device, and satisfies Class 2 of the JEDEC standard JESD22-A114-B (human body model) on all pins. It should thus be handled with all necessary ESD precautions to avoid any permanent damage.
2.2. Absolute Maximum Ratings
Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability.
Table 2
Absolute Maximum Ratings
Symbol Description Supply Voltage Temperature Junction Temperature Storage Temperature Min -0.5 -55 -55 -55 Max 3.9 +115 +125 150 Unit V C C C
VDDmr Tmr Tjunc Tstor
2.3. Operating Range
Operating ranges define the limits for functional operation and the parametric characteristics of the device as described in this section. Functionality outside these limits is not implied.
Table 3
Operating Range
Symbol Description Supply voltage Operational temperature range Load capacitance on digital ports Min 1.8 -40 Max 3.7 85 25 Unit V C pF
VDDop Top Clop
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
2.4. Electrical Specifications
The table below gives the electrical specifications of the transmitter under the following conditions: Supply voltage = 3.3 V, temperature = 25 C, fXOSC = 26 MHz, fRF = 433.93 MHz, 2-level FSK modulation Df = 20 kHz, bit rate = 10 kbit/s and output power = +10 dBm terminated in a matched 50 ohm impedance, unless otherwise specified.
DATASHEET
Table 4
Symbol
Transmitter Specifications
Description Conditions Min Typ Max Unit
Current Consumption IDDSL IDDT Supply current in sleep mode Supply current in transmit mode with appropriate external matching. RF Power o/p = +10 dBm RF Power o/p = 0 dBm 0.5 16.5 9 1 A mA mA
RF and Baseband Specifications FDA_D FDA BRF BRO OOK_B RFOP DRFOPV PHN Frequency deviation, FSK Frequency deviation, FSK* Bit rate, FSK Bit rate, OOK OOK Modulation Depth RF output power in 50 ohms Variation in RF output power with supply voltage Transmitter phase noise at 868.3 MHz High Power Setting Low Power Setting** 2.5 V to 3.3 V 1.8 V to 3.7 V Offset from centre frequency: 100 kHz 350 kHz 550 kHz 1.15 MHz Permissible Range Permissible Range Number of programmable values 10 0.5 0.5 7 -3 26 868 MHz 434 MHz No crystal contribution 8 50 10 0 8 26 3.174 1.587 100 100 10 3 7 -76 -81 -91 -101 26 +/-25 MHz kHz kHz ppm kHz kbps kbps dB dBm dBm dB dB dBc/Hz dBc/Hz dBc/Hz dBc/Hz
FR FXOSC STEP DFXOSC
Number of selectable Frequencies Crystal Oscillator Frequency RF Frequency Step Frequency Variation of the Oscillator Circuit
Timing Specifications TS_TR TOFFT RAMP Time from Sleep to Tx mode Timer from Tx data activity to Sleep PA Ramp up and down time Programmable **** 2 20 20 2 ms ms ms us
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
Min Typ 200 us + TS_OSC Max Unit ms
Symbol T_START
Description Time before CTRL pin mode selection.
Conditions Time from power on to sampling of CTRL ***
* ** ***
Frequency deviation is positive (+FDA) with DATA = `1', negative (-FDA) with DATA = `0' With two different matching networks The oscillator startup time, TS_OSC, depends on the electrical characteristics of the crystal
**** Ramp-up time of the internal regulator turning the PA on. The typical 10% - 90% power ramp-up time is 10us
2.5. Timing Characteristics
The following table gives the operating specifications for the TWI interface of the SX1240.
Table 5
Serial Interface Timing Specifications
Description CTRL Clock Frequency CTRL Clock High time CTRL Clock Low time CTRL Clock rise time CTRL Clock Fall time DATA Setup time DATA hold time From Data transition to CTRL rising edge From CTRL rising edge to DATA transition Conditions Min 45 45 45 45 Typ Max 10 5 5 Unit MHz ns ns ns ns ns ns
Symbol fctrl tch tcl trise tfall tsetup thold
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
3. Application Modes
The SX1240 has two application modes. These are selected depending upon the load presented to the Control pin (6) at power-on of the device, as shown on Figure 3. By connecting the Control pin to logical `0' or `1' the Power & Go mode is selected. A full description of operation in this mode is given in Section 3.1. By presenting a logical zero to the Control input, Advanced Mode can be accessed by subsequent clocking of the control pin, in conjunction with the Data pin (2) permits programming of the SX1240 configuration register and manual control of the transmitter. For more information on Advanced Mode operation please consult Section 3.2. The diagram below summarises the mode selection process.
Figure 3. SX1240 Mode Selection Table 6 Control Pin Selection of the Application Mode
CTRL Pin (6) Logic `1' or `0' Logic `0' then Clock on CTRL Application Mode Power & Go Mode (see Section 3.1) Advanced Mode (see Section 3.2)
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
3.1. Application Mode: Power & Go
3.1.1. `Power & Go' Mode: Configuration
The default Power & Go application mode sees the SX1240 configured as detailed in the following table. By changing the logical state of the control pin (6) at power-up, one of a pair of default configuration modes can be selected. The Power & Go application mode hence permits microcontroller-less operation. By simply powering the transmitter application circuit, the SX1240 is pre-configured as either a 434 MHz OOK transmitter or an 868 MHz FSK transmitter. For appropriate matching circuits please see Section 5.
DATASHEET
Table 7
Configuration and Band Selection in Power & Go Application Mode
CTRL (Pin 6) `High' `Low' Configuration OOK 433.92 MHz, 10 dBm FSK 868.3 MHz, Fdev = 20 kHz, 10 dBm
3.1.2. Transmitter Operation in `Power & Go' Mode
The timing of a typical transmit operation in Power & Go mode is shown in Figure 4. Here we see that a rising edge on the DATA pin activates the transmitter start-up process. DATA must then be held high for the start-up time (TS_TR) of the SX1240. During this time the SX1240 undergoes an optimized, self-calibrating, trajectory from sleep mode to transmit mode. Once this time has elapsed, the SX1240 is ready to transmit. Any logical signal subsequently applied to the DATA pin is then transmitted.
Figure 4. `Power & Go' Mode: Transmitter Timing Operation
The transition back to sleep mode is managed automatically. In 868 MHz FSK modulation mode, after 2 ms of inactivity on the DATA line, the SX1240 returns to sleep mode. If in 434 MHz, OOK modulation mode, the SX1240 waits for 20 ms of inactivity before returning to sleep mode.
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
3.2. Application Mode: Advanced
3.2.1. Advanced Mode: Configuration
Advanced mode can be accessed as described on Figure 3. Programming is performed via a two wire interface (TWI) formed by CTRL and DATA pins. Programming of the configuration register is triggered by a rising edge on the CTRL line. Upon detection of this rising edge, the data applied to the DATA pin is accepted as register configuration information, the data bits are clocked on subsequent rising edges of the clocking signal applied to the CTRL pin. The first bit of serial data selects register read or write operation (Read = `high' and Write = `low'). The timing for SX1240 configuration register `write' is shown in Figure 5. Note that, once triggered, all 13 data bits must be written to the SX1240. The contents of the configuration register and the role of each bit therein is described in Table 8 of Section 4.
CTRL
DATASHEET
DATA `0'
R/W ACC `0' `0'
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Figure 5. TWI Configuration Register `Write'.
Similarly, the configuration register may be read using the timing of Figure 6.
CTRL
DATA `0'
R/W ACC `1' `0'
`0'
`0'
`0'
`0'
`0'
D12
D11
D10
D1
D0
T42
T41
T1
T0
DATA pin is an output
Figure 6. TWI Configuration Register `Read'.
Notes - Logic level `0' on DATA during the first rising edge on CTRL is required to start the TWI access - Reading only the 13 configuration bits D0 to D12 is not allowed on the SX1240. In Read access, 64 clock cycles on CTRL pin must be issued, shifting out on pin DATA the 13 configuration bits (D0 to D12), plus 43 internal test bits (T0 to T42). Read access should be used when developing the device firmware, but is not intended for use in the normal operation mode. - During the register `write' or `read' phases the SX1240 remains in sleep mode.
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
When powering up the circuit (microcontroller and SX1240), the logic level of the CTRL pin is sampled after T_START, as described on Figure 3. During T_START, the microcontroller IO driving the CTRL pin must be configured as an output, driving the CTRL pin to the desired state. Note whilst the logic level of CTRL pin during T_START (initialization phase of the microcontroller) does not have any effect on the device operation, the pin should not be connected to VDD through an impedance lower than 20 k ohms or higher than 1 M ohms.
Figure 7. Power-up Timing
3.2.2. Transmitter Operation in Advanced Mode
When operating in advanced mode two possibilities exist for operation of the transmitter, these are dependent upon the state of the Tx Mode bit (D12 of the register description in Table 8). Tx Mode = `0' When set to logical `0' operation is identical to that of the Power & Go mode, following completion of the programming phase, the SX1240 will be placed in transmit mode upon the next rising edge detected on the DATA pin. Transmit operation will then be in accordance with that of Figure 4 with the time TOFFT corresponding to that programmed. Note that prior to programming the default, logical `0', configuration is loaded. Note also that subsequent programming iterations can only be performed once the transmit cycle is finished - including the time required for switching off the PA (TOFFT). Tx Mode = `1' With Tx Mode (D12) set to `1' during the register programming cycle detailed in Figure 5, the SX1240 is placed directly in transmit mode. It will then remain in transmit mode until a second TWI register write operation where, if reset to logical `0', the SX1240 returns to sleep mode. An illustration of this operation is shown in the following timing diagram. Please also note that once in sleep mode, subsequent activity on the DATA pin (without clocking of the CTRL line) will trigger transmission in accordance with Figure 4. Care must hence be taken to avoid inadvertent transmission due to such activity.
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
D12 = '1'
D12 = '0'
Data
TWI Config
TWI Config
Ctrl
TS_TR RF Out
RAMP
State
Sleep
Tx
Sleep
Tx Enable
Data Transmission
Tx Off
Figure 8. Manual Control of Transmitter Enable via the TWI
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
4. Configuration Register
Table 8 SX1240 TWI Register Description
Default Bit D12 D(11:9) Name Tx Mode Frequency Nbits 1 3 State 0 1 000 001 010 011 100 101 110 111 0 1 000 001 010 011 100 101 110 111 0 1 0 1 011 010 001 000 111 110 101 100 Setting CTRL = `0' Power & Go Forced Transmit 418.00 MHz 433.42 MHz 433.92 MHz 864.00 MHz 868.30 MHz 868.65 MHz 868.95 MHz 869.85 MHz FSK OOK 10 kHz 12.5 kHz 20 kHz 25 kHz 40 kHz 50 kHz 80 kHz 100 kHz 0 dBm 10 dBm 2 ms 20 ms fc + 6 * PLL Step fc + 4 * PLL Step fc + 2 * PLL Step fc + 0 * PLL Step fc - 2 * PLL Step fc - 4 * PLL Step fc - 6 * PLL Step fc - 8 * PLL Step 0 CTRL = `1' 0 When set to `1' SX1240 is in continuous Tx until reset to `0'. RF Operating centre frequency 010 100 Notes
D8 D(7:5)
Modulation Freq. Deviation
1 3
0 1
Modulation format FSK Frequency deviation (not used in OOK mode).
010
010
D4 D3 D(2:0)
RF Power Tx Timer Fine Tuning
1 1 3
Programmed RF output power. 1 0 1 Fine tuning from programmed centre frequency. 000 000 1 Transmit power-off timer.
T(42:0)
Test
43
-
-
Test registers
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
5. Application Information
5.1. Crystal Specification
The SX1240 is designed to operate with a low-cost 26 MHz crystal.
Table 9
SX1240 Quartz Crystal Reference Oscillator Specification
Description Crystal Frequency Crystal Motional Inductance Crystal Motional Capacitance Crystal Serial Resistance Crystal Shunt Capacitance Load Capacitance Conditions Min 26 Typ 26 12.655 2.962 20 1.0 15 Max 26 100 7.0 Unit MHz mH fF Ohms pF pF
Symbol FXOSC LM CM RS C0 CL
5.2. Reference Design Schematics
VCC
R1 C6 GND C5 GND L1 U1 SX1240 RFOUT GND SCK VBAT 8 7 6 5 VCC GND GND GND GND GND GND C7 C1 Antenna1 C2 C3 C8 L3 C4 RFIO1
P1 10 9 8 7 6 5 4 3 2 1 MHDR1X10 GND GND 1 xtal 26 MHz 2 Data R6 Ctrl
GND
1 2
L2
GND DATA GND XTAL
LM C11
GND Q1
3 4 2
R_VBAT
VBAT GND 1 XTAL 26 MHz Q2 3
GND
R2 NC
R3 NC R4 0R0
VCC
4
GND
Figure 9. Application Module Schematics (See BoM for Optional Components)
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
5.3. Reference Design PCB Layout
With careful RF design practices, the SX1240 can be designed on a single-layer PCB, optimizing the cost of the application. The single layer design below also features a spiral antenna and optional on-board regulation.
DATASHEET
1
1
2
2
2
1
1
4
3
2
1
2
1
1
2
1
3
1
1
1
1
4
5 6 7 8 2 2 1 2 1 2 2 1 2 2
2
3
1 2 2 1
1
1
1
2
1
2
1
2
1
2
2
1
2
1
2
1
2
2
4 3
2
1
2
5
2
2 1
6
2 1
1
1
1
2
3
4
5
6
7
8
9
10
Figure 10. Reference Design PCB Layout
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
5.4. Reference Design BOM
The following tables summarize the module BoM for 434 MHz and 868 MHz band operation.
DATASHEET
Table 10 434 MHz Single Layer Reference Design BoM
Designator U1 Q1 C1 C2 C3 C4 C5 C6 C7 C8 L1 L2 L3 Q2 C11 LM R1 R2 R3 R4 R VBAT R6
Part Number SX1240ISRT LQG15 LQG15 LQG15 -
Package SO8 HC49 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 2.5 x 3.2 mm 0402 0402 0402 0402 0402 0402 0402 0402
Value SX1240 26 MHz NC 3.3 pF S/C 8.2 pF 100 pF 100 nF 1 pF 8.2 pF 120 nH 22 nH 15 nH 26 MHz TBC TBC 0R0 0R0 0R0 0R0 0R0 0R0
Qty 1 1 0 1 0 1 1 1 1 1 1 1 1 -
Description RF Transmitter IC Crystal 26 MHz CL = 15 pF Capacitor NPO (+/-5%) Capacitor NPO (+/-0.25 pF) Capacitor NPO (+/-5%) Capacitor NPO (+/-5%) Capacitor X7R (+/-10%) Capacitor NPO (+/-0.25 pF) Capacitor NPO (+/-5%) Multilayer chip inductor Multilayer chip inductor Multilayer chip inductor Optional replacement of Q1 Antenna Matching Component Antenna Matching Component Optional PA Supply Isolation Optional CTRL `hi' Connection Optional CTRL `lo' Connection Optional CTRL Isolation Optional Supply Isolation Optional Data Connection to header
Manufacturer Semtech Murata or equivalent Murata or equivalent Murata or equivalent -
Table 11 868 MHz Reference Design BoM
To be Confirmed
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
6. Packaging Information
6.1. Package Outline Drawing
Figure 11. Package Outline Drawing
6.2. Land Pattern
Figure 12. Land Pattern
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Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
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6.3. Tape & Reel Specification
Carrier Tape Tape Width (W) 12 +/-0.30 Pocket Pitch (P) 8 +/-0.10 Ao / Bo 6.5 / 5.4 +/-0.30 Ko 2.00 +/-0.15 Reel Size 330.2
Reel Reel Width 12.4 Min. Trailer Length 400 Min. Leader Length 400 QTY per 2500 Unit mm
Figure 13. Tape & Reel Specification
Note Single Sprocket Holes
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Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
7. Revision History
Revision History
Revision Date 1 October 2010 First FINAL datasheet version Comment
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SX1240
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
(c) Semtech 2010 All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. Semtech assumes no responsibility or liability whatsoever for any failure or unexpected operation resulting from misuse, neglect improper installation, repair or improper handling or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified range. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER'S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise.
Contact information
Semtech Corporation Advanced Communications & Sensing Products
E-mail: sales@semtech.comacsupport@semtech.comInternet: http://www.semtech.com USA 200 Flynn Road, Camarillo, CA 93012-8790. Tel: +1 805 498 2111 Fax: +1 805 498 3804 12F, No. 89 Sec. 5, Nanking E. Road, Taipei, 105, TWN, R.O.C. Tel: +886 2 2748 3380 Fax: +886 2 2748 3390 Semtech Ltd., Units 2 & 3, Park Court, Premier Way, Abbey Park Industrial Estate, Romsey, Hampshire, SO51 9DN. Tel: +44 (0)1794 527 600 Fax: +44 (0)1794 527 601
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